If
a device is obsolete and there is no viable alternative device available then TS2 Micro can design, package and test an ASIC to mimic the performance of the original device.
TS2 Micro offer:
Over 15 years ASIC design experience.
Established relationships with a range of foundries.
Wafer probe capability.
Many years ASIC packaging expertise.
Full range of test equipment.
Mixed signal test capability.
Read more (pdf link)