TS2 Micro Ltd ‘Hermes’ product facilitates packaging of semiconductor die in plastic package in low (<50pcs) to medium volume. The product may be manufactured to emulate an industry standard plastic package footprint (SOP, TSOP, PLCC, QFN) or provide a unique customer specific footprint.
Based on a laminate substrate with gold solderable lands on the underside Hermes may be designed with a wide variety of footprints. A full range of die types may be wire bonded to the top surface and epoxy coated to provide mechanical protection and a flat surface for pick and place applications. Full electrical test is available, at military temperature extremes, if required.
Where a die is still available but a plastic package is obsolete Hermes is the perfect solution. The footprint can be made to fit a wide range of standard sites offering a form, fit and function replacement. TS2 Micro is able to electrically test a wide range of devices to ensure the device complies with any existing specification.