Footprint Conversion Adaptor
If a package style is obsolete TS2 Micro can adapt the footprint of readily available equivalent packaged parts to match the original footprint. Leaded parts may be re-formed but the most common approach is to mount the available device to a substrate fitted with an appropriate leadframe, ball or column array. This approach is possible for ceramic parts (a ceramic substrate may be employed) but is more common in COTS applications.
For example a FPGA device no longer available in PLCC(68) package but still available in TQFP package may be adapted – using a TS2 Micro designed substrate with a J leaded leadframe - to fit the original site on the system board.