TS2 Micro offer a selection of ASIC design services, from silicon design through to a full ‘turnkey’ solution of design, test, packaging, test (at military temperature extremes) and qualification (to MIL standard). TS2 Micro control the entire process; in house design is coupled with wafer test, packaging in ceramic package and test in our UK based manufacturing facility.
We have long term experience in the marketplace. Strong technical links with foundries help ensure the appropriate technology is used and good commercial links assist in ensuring foundry access.
Starting from an idea or concept, a design is entered into our Cadence based CAD system either as schematics, netlists or Verilog VHDL. The initial idea may be revised several times until a suitable and customer acceptable solution is found. Extensive simulation and rigorous analysis follow, both pre and post layout determined by our design review stages. Customer liaison is paramount to project success so the customer is appraised and involved at each stage which compliments our right first time project methodology.