TS2 Micro Ltd ‘Hermes’ product facilitates packaging of semiconductor die in plastic package in low (<50pcs) to medium volume. The product may be manufactured to emulate an industry standard plastic package footprint (SOP, TSOP, PLCC, QFN) or provide a unique customer specific footprint.
Based on a laminate substrate with gold solderable lands on the underside Hermes may be designed with a wide variety of footprints. A full range of die types may be wire bonded to the top surface and epoxy coated to provide mechanical protection and a flat surface for pick and place applications. Full electrical test is available, at temperature extremes, if required.
A low volume plastic packaging technology is also available to manufacture plastic TO type packages in low to medium volume. Please contact
sales@ts2micro.com for more information.