TS2 Micro prime focus is miniaturisation of electronic systems. We design, manufacture and test innovative solutions to application specific electronic component packaging problems. A carefully constructed, fully tested, System in Package solution not only significantly increases system functionality, it also increases reliability by reducing interconnect on the system board.
A range of techniques has been developed to address the demands of various applications. A standard Chip on Board (laminate) approach is the standard solution, increasing density by eliminating the plastic package. Double sided modules with die top and bottom further increase die packaging density.
Flip chip on board (Gold stub bumped die) takes space saving to another level by eliminating the area required for wire bond, it is also offers the potential to increase performance in high frequency systems by reducing the length of interconnect.
For systems requiring a processing element then a combined surface mount assembly / chip on board approach is often the most appropriate. Eliminating the high die costs (minimum order) and bare die test costs associated with processor, DSP and FPGA die product.