TS2 Micro has developed Europe’s widest range of packaging capabilities and techniques that allow us to handle practically any interconnection requirement. This packaging capability is available to customers as a sub-contract manufacturing service.
Semiconductor die may be packaged on laminate (chip on board), or for more specialist applications ceramic or metal can packages, to customer specification. Product screening and test services are also available if required.
Manufacture of standard modules (packaged part on laminate substrate) or mixture of packaged part and chip on board are also available as sub contract manufacturing services.
TS2 Micro possesses many years experience packaging a wide range of semiconductor technologies, some of which are listed below:
Amplifiers |
Modulators |
A/D & D/A converters |
Rectifiers |
Crystals |
Regulators |
Comparators |
Switches |
Diodes |
Operational amplifiers |
Drivers / Receivers |
Phase locked loops |
Logic |
Transistors |
FET |
Voltage references |
Memories |
V to F converter |