The continual market introductions of new and improved technologies in electronics, coupled with the drive for miniaturisation, places increasingly challenging requirements for packaging solutions that do not compromise performance or price.
To meet these growing demands, TS2 Micro has developed Europe’s widest range of packaging capabilities and techniques that allow us to handle practically any interconnection requirement.
TS2 Micro provides solutions for a range of industrial markets including Medical, Wearable electronics, RF applications, RFID and lighting applications.
Semiconductor die are generally packaged using laminate substrates and packages although ceramic and metal can is available for specialist applications. TS2 Micro have many years experience of design and manufacture of multi die modules using chip on board technology. For monolithic die packaging a small selection of standard plastic packages are available. The ‘Hermes’ provides a low to medium volume solution for other monolithic die packaging requirements.
In general TS2 Micro employ their extensive design and engineering expertise to design and manufacture product but sub contract manufacture to customer specification is also an option. Extensive electrical test facilities are available to provide a full ‘Turnkey’ solution from design through to final product test if required.