TS2 Micro, combined with sister company Mintech Semiconductors work with a range of customers to address the demanding interconnect issues of wearable electronics. Mintech Semiconductor are able to process (thin, saw, inspect) die specifically for wearable applications; TS2 Micro Ltd provide the interconnect and die packaging expertise.
TS2 Micro also work with a select range of customers in joint venture arrangements jointly developing innovative new products for the wearable electronics marketplace.
Please contact us to discuss your specific requirements –
sales@ts2micro.com