TS2 Micro are sensor die packaging experts. Our experienced engineering and production team are able to provide solutions to special (often unusual) customer packaging requirements.
We offer
- Design services
- Prototype manufacture
- Design for manufacture
- Medium quantity production (UK facility)
- Mass production (ASIA facility)
We package sensor on laminate, flex, glass or ceramic substrates.
Please contact us to discuss your specific requirements –
sales@ts2micro.com