TS2 Micro has extensive experience of packaging semiconductor for R.F applications to customer specifications in a range of packages including:
- Specialist QFN
- Ceramic QFP
- LCC
- Die on specialist substrate
We support prototype requirements of a few pieces up to volumes of 350Kpcs / annum in our UK facility. Mass production volumes are available from TS2 Micro (ASIA) facility.
Please contact us to discuss your specific requirements –
sales@ts2micro.com