TS2 Micro Ltd provide semiconductor die and sensor / MEM packaging services to a wide range of medical customers. Typical services include
- Prototyping services – Start up companies or New products.
- Sensor packaging – Including specialised die attach/alignment and specialist wire bond.
- Miniaturisation – Reduce size / change aspect ratio.
- Production ready – From prototype to low quantity production.
- Production services – Die / Sensor packaging or COB/SMA assembly to specification – medium volume (UK manufacture) or mass production in TS2 Micro (ASIA) facility.
TS2 Micro also work with a select range of medical customers in joint venture arrangements jointly developing innovative new products for the medical marketplace.