If a ceramic packaged product is made obsolete then TS2 Micro may offer a replacement product based on either the original die type or a near equivalent.
TS2 have access to die from Mintech Semiconductors extensive die stock (preferred source) or from a range of other trusted die sources. Die may be packaged into an appropriate open tool ceramic package, tested and screened to the original or agreed specification all within TS2 Micro U.K based manufacturing facility.
If an open tool package is not available then TS2 Micro have the design capability to either make minor changes to an existing package or design an entirely new package with the same dimensions/footprint as the original part.