Increasingly die banking is becoming the key tool in the management of obsolescence, offering a low overall cost and effective solution to the problem of component discontinuation. The service is to supply and store die in controlled conditions for a last time buy or to safeguard critical components designed into long term projects. Product can be obtained from the original manufacturers and stored at nominal cost for packaging in the event of future needs. Normally this is stored in its wafer until the die requires processing into its packaged form.
The advantage of this solution is that it requires no new design intervention; no re-qualification and can use the same manufacturing technology. The cost is at its lowest form, there is flexibility to to use different package styles and the product when packaged is new (silicon, if stored correctly, does not have any wear out mechanism). In storage the product will not suffer from conditions that occur when storing a packaged device such as poor solderability, moisture migration and package degradation.
To offer this service it is key to be a franchised die supplier. TS2 Micro have access to the full range of
Mintech Semiconductors die franchises. Only the franchised supplier has the close working relationship with the manufacturer enabling them to provide notification of last time buys, product change notification and the technical data required to ensure the product complies with the end package requirement.
Read more