High reliability projects often require high density, high reliability
semiconductor packaging but at a competitive price. To address this requirement
TS2 Micro offer high density module products based on laminate substrates and
standard plastic components (or die – chip on board) but designed to withstand
an extended temperature range (-55 to 125ºC).
| TS2_Micro_Part_No | Description | |
| MP1000VS32JC | 1Mx32 SRAM - FAST - 3.3V - Plastic PLCC |
|
| MP256S32 | 256Kx32 SRAM - Fast - plastic PLCC |
|
| MP512F32 | 512Kx32 FLASH plastic PLCC |
|
| MP512S32JC | 512Kx32 SRAM - Fast - plastic PLCC |
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