TS2 Micro has developed Europe’s widest range of packaging capabilities and techniques that allow us to handle practically any interconnection requirement. This packaging capability is available to customers as a sub-contract manufacturing service.
TS2 Micro may either package to customer specification using free issue material or input an element of design service as required. Typical solutions include, chip on board, chip on flex and system in package.
TS2 Micro possesses many years experience packaging a wide range of semiconductor technologies.