TS2 Micro has developed Europe’s widest range of packaging capabilities and techniques that allow us to handle practically any interconnection requirement. This packaging capability is available to customers as a sub-contract manufacturing service.
Semiconductor die may be packaged into ceramic, metal or laminate (chip on board) packages to customer specification. Product screening and test services are also available if required.
TS2 Micro possess many years experience packaging a wide range of semiconductor technologies, some of which are listed below:
Amplifiers |
Modulators |
A/D & D/A converters |
Rectifiers |
Crystals |
Regulators |
Comparators |
Switches |
Diodes |
Operational amplifiers |
Drivers / Receivers |
Phase locked loops |
Logic |
Transistors |
FET |
Voltage references |
Memories |
V to F converter |