sub-contract
assembly services
TS2 Micro - Electronic Component Packaging Services
TS2 Micro Ltd offer semiconductor die packaging, test and obsolescence services for industrial, commercial, aerospace, space and military markets.
TS2 Micro Ltd has developed Europe’s widest range of packaging capabilities and techniques which allow the company to handle practically any interconnection requirement. We support demand for a few pieces for prototyping to several thousand pieces per month production.
With design, manufacture and test housed in the same UK based ISO9001/2000 approved facility TS2 Micro is well placed to support the European marketplace.
TS2 Micro Ltd is a member of the
ASC Group Europe.